110+ patents in Wi-Fi, Bluetooth, and RISC-V — enabling 500,000+ developers to build the next wave of IoT innovation.
From custom RISC-V cores to Matter-native SoCs, every chip we design pushes wireless forward.
Next-generation 802.11ax silicon delivering 3x throughput with 75% lower latency in dense environments.
Purpose-built RISC-V cores optimized for IoT workloads — balancing performance, power, and silicon area.
First-wave Matter-certified chipsets enabling seamless interoperability across Apple, Google, and Amazon ecosystems.
Integrated neural network accelerator enabling keyword spotting, gesture recognition, and anomaly detection at the edge.
Modular chipset families designed to scale from battery-powered sensors to enterprise gateways.
802.11ax/ac/n modules with integrated antenna, flash, and PSRAM — certified for global deployment.
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Bluetooth 5.3 and BLE mesh-capable modules for audio streaming, asset tracking, and proximity sensing.
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Dual-core SoCs with Wi-Fi + Bluetooth + Zigbee/Thread combo radios and open-source development frameworks.
View ProductsFrom smart homes to industrial floors — our wireless platforms enable intelligence at every edge.
Research breakthroughs, ecosystem updates, and technology deep dives from the Espressif engineering team.
Our take on 802.11be Multi-Link Operation and how it transforms dense IoT deployments with deterministic latency.
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The open instruction set architecture gives us full control over power/performance trade-offs — here is what we have learned.
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New device types, energy management features, and our contributions to the Connectivity Standards Alliance roadmap.
Read More →Whether you are prototyping a new IoT product or scaling to millions of devices, our engineering team is ready to help.
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